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      NXP Semiconductors BYC8-600 Hyperfast power diode BYC8-600 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2013. All rights reserved Product data sheet 23 May 2013 3 / 9 003aab472 0 0 5 10 15 20 25 30 4 8 12 IF(AV) (A) Ptot (W) δ=1 0.5 0.2 0.1 Fig. 1. Forward power dissipation as a function of average forward current; square waveform; maximum values 003aab471 0 0 4 8 12 16 20 2 4 6 IF(AV) (A) 8 Ptot (W) a = 1.57 1.9 2.2 2.8 4.0 Fig. 2. Forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base Fig. 3 - - 2.2 K/W Rth(j-a) thermal resistance from junction to ambient free air - 60 - K/W 003aac977 1 10- 1 10 Zth(j-mb) (K/W) 10- 3 - 6 10- 2 tp (s) 10 10 1 10-1 10-5 10-3 10-2 10-4 tp t = p T P t T δ Fig. 3. Transient thermal impedance from junction to mounting base as a function of pulse width |